Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

$289.00
+ $23.99 Shipping

Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

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Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

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Description

New insights have to be developed in many domains including electrical thermal noise interconnects and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm going to a synthesis beginning between many technical aspects.
  • Brand: Taylor & Francis Ltd
  • Category: Computing & Internet
  • Format: Hardback
  • Language: English
  • Publication Date: 2025-09-04
  • Publisher / Label: Taylor & Francis Ltd
  • Author: Yue Ma
  • Number of Pages: 226
  • Fruugo ID: 434312144-911519312
  • ISBN: 9780367023430

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  • STANDARD: $23.99 - Delivery between Wed 26 November 2025–Tue 16 December 2025

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